Featured Member: Reynaldo Olmedo on HBCU CONNECT!

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Reynaldo Olmedo
Product Lifecycle and Technology Program Manager, Oracle
Location: Medford, MA United States
Joined: Oct 22nd, 2020

About (request update)

Education (request update)

Florida Int`l Univ class of 1990

Undergrad Major: Mechanical Engineering

Experience

I currently work with Oracle as Product Lifecycle and Technology Program Manager
I have years of experience working in the Computers, Hardware industry.

Product Lifecycle and Technology Operations Program Manager | Oracle
From October 2016 to Current • 10 year(s)
Managed development and launch of three generations of high performance cloud and on-premise server products, enabling new external manufacturers and achieving significant cost reductions and cycle time improvements.

R&D Engineering Senior Manager, Assembly/Test Technology Development | Intel
From January 2013 to June 2016 • 3 year(s)
Managed team of 8 senior engineers developing 50 direct materials for assembly across Intel product line, delivered 30% BOM cost reduction and 40% reduction in time to market.

R&D Engineering Senior Manager, Assembly/Test Technology Development | Intel
From January 2011 to January 2013 • 2 year(s)
Developed methodology for design for cost in power delivery solutions representing $60M yearly spend, identified and drove DFC savings exceeding $30M over 3 years.

Path-finding Engineering Senior Manager, Assembly/Test Technology Development | Intel
From September 2006 to December 2010 • 4 year(s)
Led global team to deliver industry leading substrate technology from concept to high volume manufacturing, managed multi-party collaboration and $20M supplier investment.

Engineering Manager, Assembly/Test Technology Development | Intel
From December 2004 to September 2006 • 2 year(s)
Managed portfolio of 18 electronic packaging materials projects, responsible for budget and performance management of 16 senior engineers, delivered $9M in design for cost savings.

Engineering Manager, Assembly/Test Materials Operations | Intel
From August 1999 to December 2004 • 5 year(s)
Owned NPI and volume scale-up processes for flip chip substrate technologies with $1.5B yearly spend, delivered $120M in value engineering savings.

Senior Engineer and Materials Manager, Assembly/Test Materials Operations | Intel
From June 1993 to August 1999 • 6 year(s)
Managed polymer and gold bonding wire supply chain with $50M annual spend, led new site startup in Costa Rica and implemented configuration management systems.

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